Adeia Semiconductor Bonding Technologies Inc. and two of its units accused chipmaker
Several AMD products use methods protected by ten patents, according to Adeia’s two lawsuits filed Monday in the US District Court for the Western District of Texas. The cases focuse in part on what’s called hybrid bonding in semiconductor manufacturing, a technique that Adeia says allows greater density of connections in multilayer chips.
AMD desktop and laptop processors, accelerators, and graphics products using its 3D V-Cache technology—which stacks ...